Burn In Board
バーンインボード
Job Description
Development, design, manufacturing, and inspection of semiconductor evaluation test boards
Burn In boards and IC reliability test boards history
Syowa Sangyo’s burn In boards and various IC reliability test boards were developed
and supplied for the aerospace and defense market since 1987.
Now, our boards are approved and supplied by various semiconductor manufacturers,
companies specializing in semiconductor packaging processes (OSAT), optical devise
companies and power devise companies.
Business Flow
Product Information
High-Temperature Evaluation Boards for Laser Diodes and Optoelectronic Devices
- Optimized for simplified aging tests using general-purpose temperature and humidity chambers.
- Designed to connect external power supplies through heat-resistant connectors and cables.
- No dedicated burn-in system required, enabling low-cost implementation.
- Supports custom sockets, including ultra-small chips and sensor-integrated devices.
- External control boards can also be designed, such as constant-current drive power modules.
- Board dimensions are tailored to fit the specifications of your temperature chamber.
High-Voltage, High-Temperature Evaluation Boards for IGBTs and Power Semiconductor Devices
- Optimized for simplified aging tests using general-purpose temperature and humidity chambers.
- Substrate materials selected to accommodate high-voltage operation.
- Pattern layout designed with high-voltage insulation and creepage distances in mind.
- No dedicated burn-in system required, enabling low-cost implementation.
- Equipped with high-voltage-resistant cables and busbar wiring.
- Board dimensions can be customized to fit the temperature chamber.
- Supports operation up to 220°C with custom socket configurations.
Simplified Aging Test Set for FETs and Power Semiconductor Devices
- Optimized for simplified aging tests using general-purpose temperature chambers.
- Includes a burn-in board and auxiliary boards for power and signal supply.
- Connectable via feedthrough boards or heat-resistant cables.
- No dedicated burn-in system required, enabling low-cost implementation.
- Board dimensions can be customized to fit the temperature chamber.
- Ideal for benchtop debugging as well.
High-Temperature and High-Humidity Evaluation Boards for FETs and Power Semiconductor Devices
- Optimized for simplified aging tests using general-purpose temperature and humidity chambers.
- Fully conformal-coated for durability under high-temperature and high-humidity conditions.
- Compatible with chamber interfaces such as HAST pin connections.
- Components selected with consideration for high-humidity environments.
- Board dimensions tailored to fit the specific temperature and humidity chamber.
- Pattern layout and frame structure designed with heat dissipation in mind.
Aging Boards with Built-in Temperature Sensors for Optoelectronic Devices
- Custom socket development for ultra-small CoC-mounted devices.
- Sockets equipped with integrated temperature sensors compatible with test-system interfaces.
- Fully customizable, including metal fittings and mechanical components.
- Supports direct thermal contact with chillers.
- Compatible with linked socket configurations to improve assembly efficiency.
- Reduces total cost through shared base-unit architecture.
- After introducing the base unit, only socket-base development and manufacturing are required.
Large Burn-In Boards for Automotive and Aerospace Applications
- Compatible with the interfaces of both domestic and international burn-in test systems.
- Available in standard size (570 × 150 × t1.6).
- Available in large size (673 × 508 × t1.6).
- Prototyping available from a single unit.
Inquiries about burn-in boards
0551-23-7830